2023 IEEE EPS IESA Packaging workshop

Explore the forefront of semiconductor innovation with the Advanced Semiconductor Packaging Workshop, a collaborative initiative by IESA and IEEE-EPS (USA). This pivotal platform unites stakeholders across government, industry, academia, policymaking, entrepreneurship, and students to foster innovation in semiconductor packaging, focusing on microsystems packaging and manufacturing. Addressing manufacturing and educational needs, the workshop catalyzes collaborative research discussions.Its success signifies the synergistic efforts of IESA and IEEE-EPS, reflecting a promising future for joint initiatives. This underscores the commitment of the Indian and Karnataka governments to propel ESDM industry growth. It is a monumental platform within the Electronics & Semicon ecosystem, showcasing IESA's commitment to India's pre-eminence in Electronics & Semicon.